English
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About The Book
Description
Author
<p>The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability including probabilistic predictions of the solder lifetime.</p>
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Details
ISBN 13
9780367635886
Publication Date
-04-10-2024
Pages
-382
Weight
-567 grams
Dimensions
-155.98x233.98x21.46 mm
