Dynamic RAM

<p>Because of their widespread use in mainframes PCs and mobile audio and video devices DRAMs are being manufactured in ever increasing volume both in stand-alone and in embedded form as part of a system on chip. Due to the optimum design of their components—access transistor storage capacitor and peripherals—DRAMs are the cheapest and densest semiconductor memory currently available. As a result most of DRAM structure research and development focuses on the technology used for its constituent components and their interconnections. However only a few books are available on semiconductor memories in general and fewer on DRAMs. </p><p><strong>Dynamic RAM: Technology Advancements</strong> provides a holistic view of the DRAM technology with a systematic description of the advancements in the field since the 1970s and an analysis of future challenges. </p><p><strong>Topics Include:</strong></p><ul> <p> </p> <li>DRAM cells of all types including planar three-dimensional (3-D) trench or stacked COB or CUB vertical and mechanically robust cells using advanced transistors and storage capacitors</li> <li>Advancements in transistor technology for the RCAT SCAT FinFET BT FinFET Saddle and advanced recess type and storage capacitor realizations </li> <li>How sub 100 nm trench DRAM technologies and sub 50 nm stacked DRAM technologies and related topics may lead to new research</li> <li>Various types of leakages and power consumption reduction methods in active and sleep mode</li> <li>Various types of SAs and yield enhancement techniques employing ECC and redundancy</li> <p></p> </ul><p>A worthwhile addition to semiconductor memory research academicians and researchers interested in the design and optimization of high-density and cost-efficient DRAMs may also find it useful as part of a graduate-level course.</p>