Si-based microelectronic community is experiencing a sort of revolution in order to meet the scaling rate demanded by high-tech industries. Shallow p-type junctions with high active dopant concentrations are needed. The F capability in helping the B confinement in Si is widely recognized even if there is not a general consensus on the physical mechanisms acting. Different mechanisms have been proposed: a chemical bonding between F and B; or a F interaction with point defects through the formation of F-I (interstitial) or F-V (vacancy) complexes. This thesis investigates the F behaviour in pre-amorphized Si opening a new route towards the F profile engineering. F is shown to strongly modify Is and Vs population inducing an Is undersaturation or a Vs supersaturation. Such effect is transient because strictly correlated to the transient presence of F in the Si samples. Our results allow a point defect engineering by means of F ruling out the F-B chemical bonding as the responsible for B diffusion reduction by F and suggesting the F-V bonding as the key mechanism governing the F behaviour in pre-amorphized Si and its capability in controlling the point defect population.
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