Hybrid Assemblies and Multichip Modules

Providing a description of design considerations from the user's viewpoint this detailed reference discusses the materials used in manufacturing hybrid assemblies and multichip modules - illustrating how these products are created for a wide range of applications.;Examining the current state of hybrid assembly technology Hybrid Assemblies and Multichip Modules: provides a thorough overview of substrate materials and metals used for conductors addressing multilayer materials and overglazes; explicates design considerations such as circuit layout component placement thermal management and interface problems; clarifies the manufacturing techniques used for multi-layer thick-film circuits and multilayer substrates; and explains soldering and other attachment methods for discrete components.;Focusing primarily on electronic assemblies that use ceramic substrates Hybrid Assemblies and Multichip Modules should serve as a comprehensive resource for manufacturing electrical and electronics and automotive engineers; manufacturing managers; hybrid assembly designers; hybrid assembly users; printed circuit designers fabricators and users; and graduate-level students in manufacturing engineering and electronic packaging courses.