Investigations On Performance Evaluation Of CMOS VLSI

The progression in very large scale integration billions of transistors and components can be placed on a single semiconductor chip for implementation of complex circuitry. The growth in recent technology is towards miniaturization of semiconductor devices which have several noticeable hindrances in heat dissipation power utility chip area and efficiency of the devices. As the technology advances more into deep submicron level feature sizes power dissipation due to leakage current are increasing at an alarming rate. Numerous projections show that leakage power will develop into analogous to dynamic power dissipation in coming years; however dynamic power is also increasing and still dominates. The optimal solution for solving these hindrances is to analyze the performance of VLSI circuit designed using different CMOS technologies.