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About The Book
Description
Author
<p>This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging three papers on interconnect three papers on bonding technologies one paper on vacuum packaging and three papers on modeling and simulation.</p>
Piracy-free
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Details
ISBN 13
9783036542584
Publication Date
-01-06-2022
Pages
-210
Weight
-452 grams
Dimensions
-170x244x17.46 mm
