English
LOOKING TO PLACE A BULK ORDER?CLICK HERE
Piracy-free
Assured Quality
Secure Transactions
Fast Delivery
Sustainably Printed
Please enter pincode to check delivery time.
*COD & Shipping Charges may apply on certain items.
Review final details at checkout.
Piracy-free
Assured Quality
Secure Transactions
Fast Delivery
Sustainably Printed
Delivery Options
Please enter pincode to check delivery time.
*COD & Shipping Charges may apply on certain items.
Review final details at checkout.
Details
ISBN 13
9783036542584
Publication Date
-01-06-2022
Pages
-210
Weight
-452 grams
Dimensions
-170x244x17.46 mm
Details
ISBN 13
:
9783036542584
Publication Date
:
01-06-2022
Pages
:
210
Weight
:
452 grams
Dimensions
:
170x244x17.46 mm
Publisher
About The Book
Description
Author
This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging three papers on interconnect three papers on bonding technologies one paper on vacuum packaging and three papers on modeling and simulation.