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About The Book
Description
Author
<p><strong><em>Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging</em></strong> presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI) power
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Details
ISBN 13
9780367573669
Publication Date
-30-06-2020
Pages
-340
Weight
-484 grams
Dimensions
-156x234x18.07 mm
