Modeling Single-Phase and Boiling Liquid Jet Impingement Cooling in Power Electronics

Jet impingement has been an attractive cooling option in a number of industries over the past few decades. Over the past 15 years jet impingement has been explored as a cooling option in microelectronics. Recently interest has been expressed by the automotive industry in exploring jet impingement for cooling power electronics components. This technical report explores from a modeling perspective both single-phase and boiling jet impingement cooling in power electronics primarily from a heat transfer viewpoint. The discussion is from the viewpoint of the cooling of IGBTs (insulated-gate bipolar transistors) which are found in hybrid automobile inverters.