Recent Trends in VLSI and Semiconductor Packaging

<p>The International conference on Semiconductor Materials packaging AI&ML Reconfigurable VLSI architectures for IoT future Communication Technologies (“SMART-2024”) aimed to provide a platform for researchers academicians industry experts and practitioners to exchange ideas present research findings and discuss emerging trends and challenges in the specified fields. “SMART-2024” seeked to foster collaboration innovation and knowledge dissemination by bringing together experts and stakeholders from diverse backgrounds to address key issues and explore new research directions. The conference targeted a diverse audience including researchers academicians scientists engineers technologists industry professionals students policymakers and other stakeholders interested in VLSI IoT AI-ML communication systems semiconductor packaging hetero architecture devices and Nano materials.</p>