<p>The book presents the basic steps and the technical implementation of individual processes for microelectronic circuit integration in silicon. Interaction and influences of e. g. oxidation etching&nbsp;doping and thermal processes for integrating CMOS- and Bipolar circuits are discussed in detail beginning with the purification of silicon up to the encapsulated integrated circuit. It includes&nbsp;modern processes like atomic layer deposition and etching for nanoscale structures and compares improvements like silicide contacts copper metallization high-k dielectrics and SOI and FINFET structures. All processes are presented looking from the process engineer���s view.<br></p>
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