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About The Book
Description
Author
<p>Topics covered in this reprint include material characterization theoretical and empirical methods modeling simulation technology design and validation and AI-assisted design-on-simulation technology for electronic packaging. Package design engineers researchers and graduate students involved in thermal/mechanical modeling package design material selection qualification and reliability assessment of advanced packaging will benefit from this reprint.</p>
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Details
ISBN 13
9783725809721
Publication Date
-30-04-2024
Pages
-296
Weight
-586 grams
Dimensions
-170x244x23.81 mm
