As System-on-Chip (SoC) has become more pervasive in recent years the substrate noise coupling problem has become an increasing challenge in mixed-signal IC design. This book provides a thorough understanding of substrate noise generation mechanisms 3D substrate modeling and substrate noise suppression techniques. Furthermore an active noise suppression technique developed by the author is presented in detail including the theory analysis 3D substrate and isolation structures modeling simulation methodology test site design and data analysis. At the end an insightful discussion is provided helping readers comprehend the advantage limit and possible improvement of the technique. This comprehensive book serves as a manual of substrate noise helping understand substrate noise and helping choose/create effective noise suppression techniques for RF/mixed signal IC designs.
Piracy-free
Assured Quality
Secure Transactions
Delivery Options
Please enter pincode to check delivery time.
*COD & Shipping Charges may apply on certain items.