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About The Book
Description
Author(s)
<p>Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials models and designs. Furthermore depending on the geometry and ph
Piracy-free
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*COD & Shipping Charges may apply on certain items.
Review final details at checkout.
Details
ISBN 13
9780367574543
Publication Date
-30-06-2020
Pages
-232
Weight
-400 grams
Dimensions
-156x234x12.61 mm
